TESCAN Laser Ablation Tool

by Gergely Balogh

Laser Ablation Tool

TESCAN ORSAY Holding, a.s. and 3D-Micromac AG Collaborate to Increase the Efficiency of Failure Analysis Workflows

Synergy between both companies in the joint business and development activities creates a solid base for significant time and cost savings in the failure analysis (FA) workflows when compared to the current industry standard.


Brno, Czech Republic, December 18, 2020 – TESCAN, one of the leading companies in charged particle optics, 4D micro-CT and bespoke solutions, and 3D-Micromac AG, the industry leader in laser micromachining systems, collaborate to provide a more efficient workflow to diagnose a variety of materials and to root cause defects in functional materials and devices. Reducing the cost as well as time and skills demanding hours of labor to reach the region of interest (ROI), to just minutes. Currently, samples of metals, semiconductors, ceramics, and compound materials are analyzed with focused ion beam (FIB) methods. TESCAN Plasma FIB-SEM is used throughout the semiconductor, automotive, and aerospace market segments as an industryproven solution. These have, however, an increasing need for even larger volume material removal when FA is required on deeply buried ROIs or very large cross-sections.

Key benefits:

  • Cover a broad range of microstructural diagnostic techniques with the combination of TESCAN’s industry-proven Plasma FIB-SEM and a flexible laser system
  • Prepare large volume (cubic mm scale) samples or deep cross sections, quickly and without Ga implantation
  • Access deeply buried ROIs quickly and efficiently – even in non-conductive hard materials (glass, ceramics) – with the faster material removal rates of the laser and Plasma FIB combination
  • Achieve artifact-free cross sections for UHR imaging of the finest details – over the entire cross section surface – by using high-quality surface polishing
  • Reduce both time-to-sample and cost-per-sample using these technologies designed specifically for large volume material removal


Failure analysis:

  • Cross-sectioning of millimeter-scale package level samples (3D ICs, TSVs, solder balls, flip-chips, etc.) for comprehensive failure analysis.

Sample preparation:

  • Chunk sample preparation for high-resolution micro-CT analysis, atom probe tomography, and tensile or compression testing
  • Micrometer-precision, free-form sample preparation for specific geometries: in-plane TEM-investigations, H-bars for FIB cross-sectional analyses, or complex 3D-shaped samples