TESCAN AMBER 2 is a fully automated Ga FIB-SEM for routine TEM sample preparation, nanoscale characterization, and prototyping.
Offering precision and ease of use, it delivers exceptionally high FIB image quality even at low accelerating voltages. The field-free BrightBeam™ SEM column ensures high contrast nanoscale imaging and exceptional sample versatility. Whether preparing TEM samples, creating nanostructures, or characterizing nanomaterials, AMBER 2 is the perfect tool for a variety of use cases.
TESCAN AMBER 2 is a comprehensive solution for TEM sample preparation, small-scale sample fabrication, nano prototyping, and FIB-SEM materials characterization. Equipped with TEM AutoPrep™ Pro, TESCAN AMBER 2 produces high-quality TEM samples effortlessly, making TEM and STEM specimen preparation accessible to all users. TESCAN‘s OptiLIFT™ and the precise Orage™ Ga FIB column provide straightforward lift-out methods and excellent beam resolution respectively for clear imaging and beam placement. High-quality TEM samples are prepared rapidly and reliably through fully automated workflows, with the final quality enhanced by the integrated Aura™ Gentle Ion Beam for final polishing.
The AMBER 2 also features the BrightBeam™ Field-Free UHR SEM column, offering high-resolution SEM imaging without immersion magnetic fields. This makes it suitable for analyzing a wide range of materials at the lowest accelerating voltages, making it ideal for advanced surface and cross-sectional imaging with BSE energy filtering capabilities.
Key benefits of TESCAN AMBER FIB-SEM
Automate your TEM sample preparation workflow with TESCAN AMBER 2, a field-free Ga FIB-SEM system offering an easy, dependable solution for automated and versatile TEM specimen preparation.
Unlock New TEM Capabilities
Explore new TEM possibilities
by preparing inverted or planar samples and transferring them to the grid with a nanomanipulator for precise feature orientation.
Enhance Flexibility with Advanced Prototyping Tools
Fabricate, create, or modify functional devices with AMBER 2’s capabilities for electron beam lithography, ion beam prototyping, FEBID, or FIBID, enhancing design flexibility and creativity.
Streamline FIB-SEM with Automated Precision
Simplify FIB-SEM operation with TESCAN Essence™ software, automating SEM and FIB alignments and providing advanced stage collision protection for all skill levels.
Achieve Ultra-High-Resolution Imaging with Versatile Performance
Perform ultra-high-resolution imaging and nanoanalysis
on diverse materials with the BrightBeam™ field-free UHR-SEM column and high current Orage™ FIB column, ensuring excellent performance and versatility.
Unlock Deeper Insights with Multimodal Signal Detection
Gain deeper material insights with AMBER’s multimodal detection system, enabling simultaneous acquisition of multiple signals.
TESCAN Aura Gentle Ion Beam
Exceptional TEM specimen quality for clear atomic resolution and effortless investigations in (S)TEM, even for the most challenging materials.
TESCAN’s FIB-SEM simplifies (S)TEM sample preparation with its integrated Gentle Ion Beam, effectively tackling the challenges posed by demanding materials. This advanced system ensures optimal sample thickness and minimal damage for precise high-resolution (S)TEM imaging. Ultra-low energy Argon polishing delivered by the Gentle Ion Beam guarantees high-quality specimens with minimal structural damage. Paired with TEM AutoPrep Pro™, which automates FIB-SEM sample preparation, delivering reliable and repeatable results. TESCAN’s Integrated Gentle Ion Beam empowers researchers to explore the atomic realm with clarity and precision, accelerating new materials development and providing the confidence needed for breakthrough advancements.
Key Benefits of the TESCAN Aura Gentle Ion Beam System
Ultra-Thin Specimens
Produce ultra-thin TEM specimens with unmatched clarity using ultra-fine argon ion polishing at energies as low as 200 eV, ensuring minimal damage and superior specimen quality.
Efficiency and Protection
Meticulous control over TEM sample quality with integrated Gentle Ion Beam, observing samples at sub-nanometer resolution with an RSTEM detector, reducing the need for microscope transfers.
Streamlined Workflow
Automate gentle polishing of FIB samples, with SEM quality control enabled directly in FIB-SEM without sample manipulation, ensuring integrity and data quality.
High-Resolution TEM Imaging
Obtain high-resolution images from TEM experiments, revealing atomic structures free of Ga contamination from previous Ga FIB-SEM fabrication.