TESCAN SOLARIS X 2 – Advanced Plasma FIB-SEM for Semiconductor Failure Analysis
Unparalleled Precision for Deep Sectioning & High-Resolution End-Pointing
The TESCAN SOLARIS X 2 is a next-generation Plasma FIB-SEM platform designed for advanced package-level failure analysis in semiconductor devices. Combining the high-throughput capabilities of the Mistral™ Xe Plasma FIB column with the ultra-high-resolution Triglav™ electron column, this system enables deep cross-sectioning of 2.5D/3D semiconductor devices, displays, MEMS, and optoelectronic components—pushing the limits of physical failure analysis.
Key Features & Benefits of TESCAN SOLARIS X 2
✅ Fast & Efficient Bulk Material Removal
- Mistral™ Xe Plasma FIB ensures rapid, large-volume milling up to 1 mm deep, overcoming the limitations of conventional failure analysis methods.
- Higher ion beam currents (up to 3.3 µA) enable sub-mm scale defect analysis.
✅ Superior End-Pointing & Imaging
- The Triglav™ SEM column provides high-resolution imaging to precisely locate defects such as cracks, voids, and delaminations.
- Coincidence point imaging enhances workflow efficiency.
✅ Ga-Free TEM Sample Preparation
- Prepare high-quality, gallium-free TEM lamellae with superior ion beam profiles, ensuring minimal ion beam tails and maximizing sample integrity.
- Use ~3x larger ion beam currents without damaging the protective layer.
✅ Curtain-Free Cross Sections on Challenging Materials
- The Rocking Stage minimizes curtaining effects on difficult materials like polyimide, SiC, ceramics, and glass.
- TRUE X-sectioning masking technology ensures precise and artifact-free milling.
✅ Automated Workflows for Maximum Productivity
- The TESCAN Essence™ software features guided wizards and automation for seamless SEM and FIB column alignments, reducing setup time and increasing system readiness.
- Intuitive user interface supports both expert users and newcomers to failure analysis.
Applications
🔬 Semiconductor failure analysis (2.5D/3D ICs)
🔬 TEM lamella preparation
🔬 IC planar delayering
🔬 Cross-sectioning of advanced materials
🔬 MEMS & optoelectronic device analysis