The Turnkey FIB-SEM Solution for Semiconductor Failure Analysis and R&D
TESCAN SOLARIS 2 is a state-of-the-art focused ion beam scanning electron microscope (FIB-SEM) platform engineered specifically for high-quality TEM lamella preparation. Designed to meet the demanding needs of semiconductor R&D and failure analysis labs, SOLARIS 2 combines precision ion milling with ultra-high-resolution SEM imaging—enabling fast, automated, and reproducible sample preparation from even the most advanced semiconductor nodes.
Overview
The SOLARIS 2 is built on the robust TESCAN S9000 platform and integrates the Orage™ Ga FIB column with the Triglav™ SEM column—delivering industry-leading resolution and contrast, even on beam-sensitive materials. Its innovative TEM AutoPrep™ Pro module allows users to fully automate the lamella preparation process, including lift-out, thinning, and final low keV polishing—reducing sample prep time to under one hour.
Equipped with cutting-edge hardware and software capabilities, the system supports advanced lamella geometries (planar, inverted, double-cross), making it a flexible tool for both routine workflows and research-driven customization.
Powerful imaging, intelligent automation, and seamless sample handling come together in a single, user-friendly solution optimized for productivity across all experience levels.
Key Benefits of TESCAN SOLARIS 2
⏱️ Ultra-Fast TEM Lamella Prep
Complete high-quality lamella preparation from sub-10 nm semiconductor nodes in under an hour with TEM AutoPrep™ Pro.
🎯 AI-Guided Precision
Accurately end-point on a single line of transistors in FinFET or GAA devices using AI-driven fiducial recognition and high-contrast SEM imaging.
🛠️ Overnight Readiness
Automated SEM/FIB column alignments ensure the system is fully calibrated and ready to operate—even after unattended overnight routines.
🔄 Versatile Geometries with OptiLift™
Prepare top-down, planar, or inverted lamellae without extra flipping tools, thanks to the flexible OptiLift™ nanomanipulator design.
🔬 Ultra-High-Resolution Imaging
Triglav™ SEM column with immersion optics enables detailed analysis of beam-sensitive structures at ultra-low voltages.
🧠 Intuitive User Interface
TESCAN Essence™ software transforms the platform into a workflow-optimized solution, empowering users with both fully automated and semi-automated controls.
⚙️ Scalable Automation
Add batch processing, unattended operation, and FIB-SEM tomography through advanced modules like DrawBeam™ and VisualCoder to further increase throughput.