TESCAN FemtoChisel – Precision Laser Platform for Micro- and Nanomachining
The TESCAN FemtoChisel is a state-of-the-art femtosecond laser processing system designed for the most demanding micro- and nanomachining applications. Built for accuracy, repeatability, and workflow efficiency, it integrates advanced laser technology with intelligent automation and multimodal characterization to support a broad range of research and industrial needs.
High-Precision Laser Processing
FemtoChisel combines ultrafast femtosecond laser pulses with high-stability mechanics to deliver sub-micron precision and minimal thermal impact. Its laser architecture enables controlled ablation, structuring, drilling, and cutting of complex materials without compromising material integrity. This makes the platform ideal for applications where accuracy and surface quality are essential.
Integrated Machine Vision and Real-Time Control
The system incorporates an advanced machine vision module that continuously monitors the machining process. Real-time feedback enables automatic alignment, process optimization, and consistent machining quality across different samples. The vision system supports automated workflows that improve throughput and minimize user intervention.
Advanced Gas Handling for Clean, Stable Processing
The system features a sophisticated gas processing solution that provides efficient debris removal, cooling, and atmosphere control during laser machining. This enables consistent machining quality and long-term operational stability, even in demanding environments.
User-Focused, Automated Software Interface
FemtoChisel includes a user-friendly software environment for planning, executing, and monitoring machining operations. Its interface supports automated routines, recipe-based processing, and easy integration of custom workflows. Users can manage processing steps, visualize results, and optimize parameters from a single, intuitive platform.
Modular Design and Expandability
FemtoChisel is based on a modular architecture, allowing laboratories and production environments to configure the platform according to their needs. The system supports a wide range of optional characterization and analytical techniques:
- Laser-Induced Breakdown Spectroscopy (LIBS)
- Confocal microscopy
Scanning Electron Microscopy (SEM) integration - Support for various processing gases
- Larger stages and additional degrees of freedom
This modularity ensures that FemtoChisel grows with evolving research and industry requirements.
Key Application Areas
FemtoChisel supports a wide spectrum of micro- and nanomachining tasks across scientific, industrial, and high-tech manufacturing fields.
Biomedical device manufacturing
Surface structuring, reactive surface modification, and micro-feature creation for next-generation medical implants and devices.
Microelectronics and failure analysis
Selective material removal, cross-sectioning, circuit editing, and sample preparation for semiconductor diagnostics.
General micro- and nanomachining
Precision structuring, milling, drilling, and inscription on metals, polymers, ceramics, and advanced composite materials.
Why Choose TESCAN FemtoChisel
FemtoChisel offers a combination of precision, flexibility, and analytical integration that sets it apart from standard laser micromachining systems. Its ability to couple ultrafast laser processing with real-time vision control and optional multimodal characterization makes it a powerful platform for research labs, analytical centers, and advanced manufacturing facilities.
Request Consultation
If you would like to explore how the TESCAN FemtoChisel can support your applications, our team is available to assist you with technical insights, configuration advice, and project-specific guidance. Let us help you find the right solution for your micro- and nanomachining challenges.